Electroplating or electrodeposition is a process which produces a dense, uniform and adherent coating on a metal surface using electric current in an electrolytic cell. This process is mainly used to change the surface properties of a material. It is used for many technological applications, like automotive industries, electrical industries, corrosion protection of metals etc. Modeling of the electrodeposition process will assist in minimizing experimental trials for optimization of these coating strategies. In this manuscript we report the development of a mathematical model to simulate the electrodeposition of copper on cobalt-chrome alloy. The developed model was validated using experiments.