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Systems and methods for mold creation
Chankaramangalam, Jeswin Joseph Chavez, Timothy Arthur
Chankaramangalam, Jeswin Joseph
Chavez, Timothy Arthur
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2024-02-15
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Patent
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Citation
Chankaramangalam, J.J., & Chavez, T.A., inventors; Wichita State University, assignee. Systems and methods for mold creation. United States patent US 20240051188 A1. 2024, February 15.
Abstract
A mold for use in molding a surface of a component is formed from separate building blocks that are assembled together so that mold surface segments associated with each of the building blocks line up to form one contiguous mold surface that corresponds with the shape of the mold. The building blocks can be formed to have integral formations for connecting them together. The building blocks can be formed by modeling the contiguous mold surface, dividing this first mold model into sections which define discrete building block models, and then forming each building block separately based on the discrete building block models. For instance, the individual block models can be assigned to different additive manufacturing machines and then later be assembled together at a final location.
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Description
WSU inventor: Jeswin Joseph Chankaramangalam, NIAR
Application No: 18/492,242 filed October 23, 2023. Patent No: US 20240051188 A1 granted February 15, 2024.
Application No: 18/492,242 filed October 23, 2023. Patent No: US 20240051188 A1 granted February 15, 2024.
Publisher
United States Patent and Trademark Office
European Patent Office
European Patent Office
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https://ppubs.uspto.gov/api/pdf/downloadPdf/20240051188?requestToken=eyJzdWIiOiIyMWYyNmFlMy1hNmViLTRjMTgtYWQxMy1mZTczYmE2NzhkYTgiLCJ2ZXIiOiIxODczZjE5My00ZjJiLTRhNWYtOWYyYS1jZTQwMzQzY2QxMTAiLCJleHAiOjB9
https://worldwide.espacenet.com/patent/search/family/076655645/publication/US2024051188A1?q=pn%3DUS2024051188A1
https://hdl.handle.net/10057/30176
https://worldwide.espacenet.com/patent/search/family/076655645/publication/US2024051188A1?q=pn%3DUS2024051188A1
https://hdl.handle.net/10057/30176
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Use and Reproduction
Notice of Allowance Mailed -- Application Received in Office of Publications 05/14/2026