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Stress-strain analysis of single-lap composite joints under tension

Yang, Chihdar Charles
Pang, Su-Seng
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1996-01
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Article
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Keywords
Stress analysis,Adhesive bonded composite single lap joints,Bonded laminates,Coupling effect,Laminated anisotropic plate theory,Peel stress,Software Package ALGOR,Strain distribution,Stress strain analysis,Tension,Bending (deformation),Boundary conditions,Composite structures,Computer simulation,Computer software,Finite element method,Joints (structural components),LaminatesMathematical models,Numerical methods,Stress concentration,Stresses
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Citation
Yang, C., & Pang, S.-S. (1996). Stress-strain analysis of single-lap composite joints under tension. Journal of Engineering Materials and Technology, Transactions of the ASME, 118(2), 247-255. doi:10.1115/1.2804896
Abstract
Based on the laminated anisotropic plate theory, an analytical model is proposed to determine the stress and strain distributions of adhesive-bonded composite single-lap joints under tension. The laminated anisotropic plate theory is applied in the derivation of the governing equations of the two bonded laminates. The entire coupled system is then obtained through assuming the peel stress between the two laminates. With the Fourier series and appropriate boundary conditions, the solutions of the system are obtained. Based on the proposed model, the stress and strain distributions of the adherends and the adhesive can be predicted. The coupling effect between the external tension and the induced bending due to the asymmetry of composite laminates are also included. The two adherends can also have different materials and properties. An existing FEA code, ALGOR, is used as a comparison with this proposed analytical model. Results from this developed model are also compared with Goland and Reissners as well as Hart-Smiths papers.
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American Society of Mechanical Engineers (ASME)
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Journal of Engineering Materials and Technology
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ISSN
0094-4289
1528-8889 (online)
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