Kinematics analysis of the chipping process using the circular diamond saw blade

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Issue Date
1999-05
Authors
Jerro, H.D.
Pang, Su-Seng
Yang, Chihdar Charles
Mirshams, R.A.
Advisor
Citation

Jerro, H. D., Pang, S. S., Yang, C., & Mirshams, R. A. (1999). Kinematics analysis of the chipping process using the circular diamond saw blade. Journal of Manufacturing Science and Engineering, Transactions of the ASME, 121(2), 257-264. doi:10.1115/1.2831214

Abstract

One of the primary goals in the design of a diamond blade cutting system is to reduce the cutting force. By understanding the fundamentals of the kinematics of the sawing operation, these forces can be lowered and even optimized with respect to the machining parameters. In this work the material chipping geometries have been mathematically defined and derived through kinematic analysis. These geometries are bounded by four curves and depend on the parameters: depth of cut h, blade diameter D, transverse rate of the workpiece ?T , peripheral speed of the saw blade ?P , and grit spacing ?. From these chipping geometries, chip area and thickness relations have been obtained. A relation for the mean chip thickness to grit spacing ratio (tc /?) has also been obtained as a function of the nondimensional machining parameter ratios, h/D and ?T /?P . The effects of these parameters on tc were also investigated. It was found that increasing ? and D, reduces the chip thickness. Contrarily, increasing ?T , ?, and h, increases the magnitude of the chip thickness. A review of older chipping models was performed, comparing well with the developed model. The results show an excellent agreement between the new model and the older ones. However, at moderately small to large h/D values the new model yields a more exact result. Thus, for h/D values greater than 0.08, it is recommended that the kinematic model be used to compute tc and other pertinent sawing parameters (i.e., grit force and grinding ratio) which are a function of tc.

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