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dc.contributor.authorLindsted, R. D.en_US
dc.contributor.authorDiCicco, D. A.en_US
dc.date.accessioned2011-12-20T23:20:27Z
dc.date.available2011-12-20T23:20:27Z
dc.date.issued1972-05en_US
dc.identifier.citationLindsted, R. D.; DiCicco, D. A.; , "Analytical and Experimental Thermal Analysis of Multiple Heat Sources in Integrated Semiconductor Chips," IBM Journal of Research and Development , vol.16, no.3, pp.303-306, May 1972 doi: 10.1147/rd.163.0303en_US
dc.identifier.issn0018-8646en_US
dc.identifier.urihttp://hdl.handle.net/10057/4060
dc.descriptionThe full text of this article is not available on SOAR. WSU users can access the article via IEEE Xplore database licensed by University Libraries: http://libcat.wichita.edu/vwebv/holdingsInfo?bibId=1045954en_US
dc.description.abstractBecause of the complexity and interconnection density of today's integrated circuit chips, experimental measurement of individual transistor or diode junction temperatures under typical powered conditions has become increasingly difficult. In order to provide meaningful thermal data, other approaches have had to be devised. In the work described by this paper, an analytical model has been used to determine the steady state junction temperature rise on an integrated circuit chip. The effect on junction temperature of heat source size, geometry, and number of adjacent heat sources has been studied. Experimental testing on specially prepared chips has verified the analytical results.en_US
dc.language.isoen_USen_US
dc.publisherIEEEen_US
dc.relation.ispartofseriesIBM Journal of Research and Development , vol.16, no.3, pp.303-306.en_US
dc.titleAnalytical and experimental thermal analysis of multiple heat sources in integrated semiconductor chipsen_US
dc.typeArticleen_US
dc.description.versionPeer reviewed articleen_US
dc.rights.holder© IEEE, 1972en_US


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