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    Analytical and experimental thermal analysis of multiple heat sources in integrated semiconductor chips

    Date
    1972-05
    Author
    Lindsted, R. D.
    DiCicco, D. A.
    Metadata
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    Citation
    Lindsted, R. D.; DiCicco, D. A.; , "Analytical and Experimental Thermal Analysis of Multiple Heat Sources in Integrated Semiconductor Chips," IBM Journal of Research and Development , vol.16, no.3, pp.303-306, May 1972 doi: 10.1147/rd.163.0303
    Abstract
    Because of the complexity and interconnection density of today's integrated circuit chips, experimental measurement of individual transistor or diode junction temperatures under typical powered conditions has become increasingly difficult. In order to provide meaningful thermal data, other approaches have had to be devised. In the work described by this paper, an analytical model has been used to determine the steady state junction temperature rise on an integrated circuit chip. The effect on junction temperature of heat source size, geometry, and number of adjacent heat sources has been studied. Experimental testing on specially prepared chips has verified the analytical results.
    Description
    The full text of this article is not available on SOAR. WSU users can access the article via IEEE Xplore database licensed by University Libraries: http://libcat.wichita.edu/vwebv/holdingsInfo?bibId=1045954
    URI
    http://hdl.handle.net/10057/4060
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