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dc.contributor.authorHelms, Jack E.
dc.contributor.authorYang, Chihdar Charles
dc.contributor.authorPang, Su-Seng
dc.identifier.citationHelms, J. E., Yang, C., & Pang, S. (1999). Stress-strain analysis of a taper-taper adhesive-bonded joint under cylindrical bending. Journal of Engineering Materials and Technology, Transactions of the ASME, 121(3), 374-380. doi:10.1115/1.2812389
dc.identifier.issn1528-8889 (online)
dc.descriptionClick on the DOI link to access the article (may not be free).
dc.description.abstractA model of a taper-taper adhesive-bonded joint under cylindrical bending has been derived using first-order laminated plate theory. Shear correction factors were used to account for transverse shear deformation. A FORTRAN program was written to integrate the resulting system of twelve simultaneous, linear, first-order, differential equations with variable coefficients. The Linear Shooting Method was used to solve the model. A finite element model was developed using the COSMOS/M commercial finite element package to verify the analytical model for a cross-ply laminate. The analytical model results agreed well with the finite element models and predicted peak adhesive stresses within about 2% of the finite element model.
dc.publisherAmerican Society of Mechanical Engineers (ASME)
dc.relation.ispartofseriesJournal of Engineering Materials and Technology
dc.relation.ispartofseriesv.121 no.3
dc.subjectAdhesive joints
dc.subjectBending (deformation)
dc.subjectDifferential equations
dc.subjectFinite element method
dc.subjectFORTRAN (programming language)
dc.subjectMathematical models
dc.subjectShear deformation
dc.subjectStress concentration
dc.titleStress-strain analysis of a taper-taper adhesive-bonded joint under cylindrical bending
dc.rights.holderCopyright 1999 by The American Society of Mechanical Engineers

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