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dc.contributor.authorJerro, H.D.
dc.contributor.authorPang, Su-Seng
dc.contributor.authorYang, Chihdar Charles
dc.contributor.authorMirshams, R.A.
dc.date.accessioned2019-03-08T22:07:01Z
dc.date.available2019-03-08T22:07:01Z
dc.date.issued1999-05
dc.identifier.citationJerro, H. D., Pang, S. S., Yang, C., & Mirshams, R. A. (1999). Kinematics analysis of the chipping process using the circular diamond saw blade. Journal of Manufacturing Science and Engineering, Transactions of the ASME, 121(2), 257-264. doi:10.1115/1.2831214
dc.identifier.issn1087-1357
dc.identifier.issn1528-8935 (online)
dc.identifier.urihttp://dx.doi.org/10.1115/1.2831214
dc.identifier.urihttp://hdl.handle.net/10057/15860
dc.descriptionClick on the DOI link to access the article (may not be free).
dc.description.abstractOne of the primary goals in the design of a diamond blade cutting system is to reduce the cutting force. By understanding the fundamentals of the kinematics of the sawing operation, these forces can be lowered and even optimized with respect to the machining parameters. In this work the material chipping geometries have been mathematically defined and derived through kinematic analysis. These geometries are bounded by four curves and depend on the parameters: depth of cut h, blade diameter D, transverse rate of the workpiece ?T , peripheral speed of the saw blade ?P , and grit spacing ?. From these chipping geometries, chip area and thickness relations have been obtained. A relation for the mean chip thickness to grit spacing ratio (tc /?) has also been obtained as a function of the nondimensional machining parameter ratios, h/D and ?T /?P . The effects of these parameters on tc were also investigated. It was found that increasing ? and D, reduces the chip thickness. Contrarily, increasing ?T , ?, and h, increases the magnitude of the chip thickness. A review of older chipping models was performed, comparing well with the developed model. The results show an excellent agreement between the new model and the older ones. However, at moderately small to large h/D values the new model yields a more exact result. Thus, for h/D values greater than 0.08, it is recommended that the kinematic model be used to compute tc and other pertinent sawing parameters (i.e., grit force and grinding ratio) which are a function of tc.
dc.language.isoen_US
dc.publisherAmerican Society of Mechanical Engineers (ASME)
dc.relation.ispartofseriesJournal of Manufacturing Science and Engineering
dc.relation.ispartofseriesv.121 no.2
dc.subjectKinematics
dc.subjectSurface acoustic waves
dc.subjectBlades
dc.subjectDiamonds
dc.subjectThickness
dc.subjectForce
dc.subjectMachining
dc.subjectCutting
dc.subjectSawing
dc.subjectDesign
dc.titleKinematics analysis of the chipping process using the circular diamond saw blade
dc.typeArticle
dc.rights.holderCopyright 1999 by The American Society of Mechanical Engineers


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