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dc.contributor.authorRahmani, Nassim
dc.contributor.authorWillard, Bethany
dc.contributor.authorLease, Kevin
dc.contributor.authorLegesse, Ephriem T.
dc.contributor.authorSoltani, Seyed A.
dc.contributor.authorKeshavanarayana, Suresh R.
dc.date.accessioned2015-10-12T19:06:10Z
dc.date.available2015-10-12T19:06:10Z
dc.date.issued2015-09
dc.identifier.citationRahmani, Nassim; Willard, Bethany; Lease, Kevin; Legesse, Ephriem T.; Soltani, Seyed A.; Keshavanarayana, Suresh. 2015. The effect of post cure temperature on fiber/matrix adhesion of T650/Cycom 5320-1 using the micro-droplet technique. Polymer Testing, vol. 46, September 2015:pp 14–20en_US
dc.identifier.issn0142-9418
dc.identifier.otherWOS:000361160100004
dc.identifier.urihttp://dx.doi.org/10.1016/j.polymertesting.2015.05.012
dc.identifier.urihttp://hdl.handle.net/10057/11548
dc.descriptionClick on the DOI link to access the article (may not be free).en_US
dc.description.abstractThe interfacial shear strength (IFSS) of a specific carbon fiber/epoxy composite (T650/Cycom 5320-1) was investigated to determine how changes in post cure temperature affects the fiber/matrix adhesion. The degree of cure of the Cycom resin cured with the same post cure temperatures was also determined using a DSC technique. The mechanical and viscoelastic properties of the samples made from Cycom 5320-1 resin were also measured and related to the degree of cure. It was shown that the mechanical and viscoelastic properties changed as the curing temperature, and hence the degree of cure, increased. The results of the micro-droplet tests showed the interfacial adhesion increased with increasing the post cure temperature. This was attributed to the higher degree of cure and change in mechanical and viscoelastic properties of the resin, as well as the residual stresses as the post cure temperature increased.en_US
dc.description.sponsorshipThe authors wish to acknowledge NASA grant number NNX11AM08A entitled "Cure management for Bonded Composite Repair" for the funding to support this project. The authors also wish to acknowledge Cytec for donating the materials used in the study.en_US
dc.language.isoen_USen_US
dc.publisherElsevier B.V.en_US
dc.relation.ispartofseriesPolymer Testing;v.46
dc.subjectT650 carbon fiberen_US
dc.subjectCycom 5320-1 matrixen_US
dc.subjectFiber/matrix adhesionen_US
dc.subjectMicro-droplet techniqueen_US
dc.titleThe effect of post cure temperature on fiber/matrix adhesion of T650/Cycom 5320-1 using the micro-droplet techniqueen_US
dc.typeArticleen_US
dc.rights.holderCopyright © 2015 Elsevier B.V.en_US


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