Electric field analysis at triple-joints and localized defects on different composite insulators designs
Ogun, Damilola Soares, Davi
Ogun, Damilola
Soares, Davi
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Issue Date
2025-03-05
Type
Conference paper
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Keywords
Sealing materials,Degradation,Manufacturing processes,Simulation,Moisture,Metals,Quality control,Insulators,Electric fields,Stress
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Citation
D. Ogun and D. Soares, "Electric Field Analysis at Triple-Joints and Localized Defects on Different Composite Insulators Designs," 2024 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP), Auburn, AL, USA, 2024, pp. 1-4, doi: 10.1109/CEIDP61745.2024.10907400.
Abstract
Composite insulators have been extensively employed around the world due to their lighter weight, improved performance in harsh environments, and potential lower maintenance costs. However, brittle fracture caused by stress corrosion cracking may occur due to water penetration into metal end fittings during operation, even under lower mechanical loads, possibly leading to a complete failure of the composite insulator. Given that the electric field may play a role in brittle fracture of composite insulators in form of partial discharges, two of the most common existing designs that result in different locations of the triple-joint - interface consisting of metal end-fitting, air, and polymer - are studied. The electric field intensification at the triple-joints is modeled using finite element modeling and validated by analytical calculations. In addition, as another recurrent physical defect in composite insulators, air voids are assessed in different locations of the analyzed composite insulator designs to determine their criticality on brittle fracture mechanism. Results present the optimal design based on the location of the triple-joint in composite insulators, and the most critical locations where air voids may severely contribute to failure modes in the composite insulators. © 2024 IEEE.
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Publisher
Institute of Electrical and Electronics Engineers Inc.
Journal
Book Title
Series
Annual Report - Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2024. IEEE Conference on Electrical Insulation and Dielectric Phenomena, CEIDP 2024
6 October 2024 through 9 October 2024
Auburn
207442
6 October 2024 through 9 October 2024
Auburn
207442
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00849162