Heat-activated joining technology for composite to alloy piping systems
Stubblefield, Michael A. ; Yang, Chihdar Charles ; Pang, Su-Seng
Stubblefield, Michael A.
Yang, Chihdar Charles
Pang, Su-Seng
Citations
Altmetric:
Other Names
Location
Time Period
Advisors
Original Date
Digitization Date
Issue Date
1998-04
Type
Conference paper
Genre
Keywords
Composite materials,Alloy piping systems,Heat activated joining method,Alloys Curing,Dissimilar materials,Finite element method,Joining,Joints (structural components),Mathematical models,Piping systems,Temperature distribution
Subjects (LCSH)
Citation
Stubblefield, M. A., Yang, C., & Pang, S. (1998). Heat-activated joining technology for composite to alloy piping systems. Paper presented at the\ Annual Technical Conference - ANTEC, Conference Proceedings,, 11095-1098.
Abstract
A new process for joining composite to alloy piping systems, the heat-activated joining technique, has been developed. The strength of the heat coupling joint in bending, tension, and hydro static testing was comparable to the butt-weld method for composite/composite systems. A finite element model was also developed to predict the temperature distribution of the heat coupling joint during the curing process. The predicted value differed less than 10% from that of the experimental data.
Table of Contents
Description
Publisher
Society of Plastics Engineers (SPE)
Journal
Book Title
Series
Annual Technical Conference, ANTEC
