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dc.contributor.authorRaghavan, Bharadwaj Veeraen_US
dc.contributor.authorKeshavanarayana, Suresh R.en_US
dc.date.accessioned2009-11-19T21:47:32Z
dc.date.available2009-11-19T21:47:32Z
dc.date.issued2009-05-01en_US
dc.identifier.citationRaghavan, Bharadwaj Veera and Keshavanarayana, S.R.(2009). Tensile Stress Concentration due to Counter Sunk Holes in Adhesively Bonded Layered Aluminum8. In Proceedings: 5th Annual Symposium: Graduate Research and Scholarly Projects. Wichita, KS: Wichita State University, p. 172-173en_US
dc.identifier.urihttp://hdl.handle.net/10057/2251
dc.descriptionPaper presented to the 5th Annual Symposium on Graduate Research and Scholarly Projects (GRASP) held at the Hughes Metropolitan Complex, Wichita State University, May 1, 2009.en_US
dc.descriptionResearch completed at the Department of Aerospace Engineering, College of Engineeringen_US
dc.description.abstractThe adhesively bonded layered aluminum is used in aircraft structures to avoid knife edge situations when flush head fasteners are used with minimum gage skins. A 3-D finite element model was used to estimate the location and magnitude of stress concentration under remote tension for aforementioned. The influence of the countersunk depth and adhesive properties on the stress concentration was investigated for a counter sunk angle of 100 º. The stress concentration was found to be maximum at the countersink edge for Eadh/Eal > 0.1 whereas it is slightly below the countersink edge in straight shank portion for Eadh/Eal < 0.1. Stress concentration was found to be minimum when the adhesive is positioned in the countersunk section.en_US
dc.format.extent229103 bytes
dc.format.mimetypeapplication/pdf
dc.language.isoen_USen_US
dc.publisherWichita State University. Graduate Schoolen_US
dc.relation.ispartofseriesGRASPen_US
dc.relation.ispartofseriesv.5en_US
dc.titleTensile Stress Concentration Due to Counter Sunk Holes in Adhesively Bonded Layered Aluminum.en_US
dc.typeConference paperen_US


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